ALIGNED TO YOUR SOURCING MODEL AND PRODUCT LIFE CYCLE PHASE

OUR PCB ASSEMBLY SERVICES MATRIX

An Array of Sourcing and Build Solutions

Core Services We Offer

Our high-end PCB assembly is offered in various packages, designed to fit your specific sourcing and build requirements. Whether you want to ship us kitted components or have us completely manage procurement, we will fit your sourcing model. We also support each phase of the product life cycle. Our core services can be explained with a simple matrix:  

Pre-Production Builds

Proof of concept, rapid prototyping, engineering design units, new product development (NPD) or new product introduction (NPI) - any design gate your organization utilizes is supported by our pre-production PCB assembly. We offer quick turns and ultra-low volumes during this dynamic time of scope creep, troubleshooting and iterations.

Production Builds

As design revisions become rare and you enter into a stable state, we match your needs for a reliable, planned system to produce medium to high volumes. ('Medium' and 'high' volumes are subjective, widely used terms in the industry. Please contact us to make sure your definitions match with ours.)

Lean Manufacturing Builds

Either as supply chains mature or while working in tandem with engineering and operations professionals, we provide a robust Lean toolkit. Milk runs in the Seattle area and kanban initiated production for domestic customers are two ways we can supply just-in-time (JIT) deliveries. Our box builds (upper-level assemblies) reduce waste in value streams. We welcome you to consult and utilize us for your Lean needs.

Obsolescence Management Builds

This product life cycle stage presents an assortment of challenges for our customers. Sunsetting a design, reactivating an old product, dealing with processor obsolescence, or plugging the tribal knowledge hole left by employment turn are the most common challenges. Therefore, we've invested in technology to address these needs.

UTILIZING EMERGING TECHNOLOGIES

How We Manufacture

IP and Technological Innovation

We continue emphasizing science in our manufacturing solutions, repeatability in our processes, and integrity in our interactions. As our equipment and IP resources grow, we get amped by each new value add we bring to the market. Our ongoing excitement to innovate within the electronics manufacturing industry propels us to work with like-minded individuals and organizations. Here's a sample of how we manufacture:

Precision Lead Forming

We form flat packages with tooling that creates uniform, coplanar leads. This is done onsite, eliminating transit time and shipping costs between forming and PCB assembly. Whether your needs are tied to defense or aerospace, contact us for more information about our component lead forming services.

Solder Paste Jet Printing

Delivering consistent quality at an exceptional pace, our jet printing process removes multiple constraints from the traditional stencil method. Non-contact nozzle technology delivers deposit accuracy up to 33 μm while not inducing stress to the PCB. Software drives quick-click optimization of individual profiles. And since designs are increasing in complexity and reducing in size, we've invested in this 3D process to better serve our customer base.

Vapor Phase Soldering

We reflow in an inert environment, which drastically reduces voids. The physics of liquid-to-vapor transition make over temp conditions virtually impossible. Additionally, this process provides an immersion cloud for consistent coverage, even across complex geometries. Superior solder joints are the result.

So Much More

In addition to our industry "me-too" solutions—SMT, AOI, and x-ray—we have several differentiating technological solutions for end-to-end PCB assembly. Also, we're continually growing our IP. More info about capabilities and how to leverage our knowledge base will be available in our customer technical center by late 2017. Until then, we welcome visits to our Seattle area facility.